Vacuum diffusion bonding of CoCrFeNiMo MEAs and Inconel 718 using Ni interlayer

Authors

Yali Zhang, Key Laboratory of Advanced Technologies of Materials, Ministry of Education
Xiaosong Jiang, Key Laboratory of Advanced Technologies of Materials, Ministry of Education
Yongjian Fang, Key Laboratory of Advanced Technologies of Materials, Ministry of Education
Hongliang Sun, Key Laboratory of Advanced Technologies of Materials, Ministry of Education
Tingfeng Song, CSIC - Instituto de Ciencia de Materiales de Barcelona (ICMAB)
Defeng Mo, Shanghai Institute of Technical Physics Chinese Academy of Sciences
Xue Li, Shanghai Institute of Technical Physics Chinese Academy of Sciences
Zhiping Luo, Fayetteville State University

Document Type

Article

Publication Date

11-15-2020

Abstract

Diffusion bonding of Co28.5Cr21.5Fe20Ni26Mo4 medium-entropy alloys (MEAs) and Inconel 718 (IN718) using Ni interlayer was studied. The results showed that interface layer I (IL-I) between IN718 and Ni interlayer mainly consisted of Ni solid solution (Ni(ss)), and interface layer II (IL-II) between MEAs and Ni interlayer mainly consisted of Ni(ss) and less ? phase. When bonding temperature was 950 °C, the better solid solution strengthening effect was produced at interface, so maximum average tensile strength of the bonded joints was 1627.92 MPa.

Recommended Citation

Zhang, Yali; Jiang, Xiaosong; Fang, Yongjian; Sun, Hongliang; Song, Tingfeng; Mo, Defeng; Li, Xue; and Luo, Zhiping, "Vacuum diffusion bonding of CoCrFeNiMo MEAs and Inconel 718 using Ni interlayer" (2020). College of Health, Science, and Technology. 988.
https://digitalcommons.uncfsu.edu/college_health_science_technology/988